• Two-component epoxy resin special adhesive
  • Two-component epoxy resin special adhesive
  • Two-component epoxy resin special adhesive
  • Two-component epoxy resin special adhesive
  • Two-component epoxy resin special adhesive
  • Two-component epoxy resin special adhesive
  • Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
Two-component epoxy resin special adhesive
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Two-component epoxy resin special adhesive

· Confidential potting of electronic components · Confidential potting of electronic circuits

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  • Details
  • Product Introduction 
    This product is a two-component epoxy resin special adhesive 
    Product features: easy to use, easy to operate, strong adhesion, corrosion resistance, low shrinkage force 
    Characteristics of cured material: strong sealing and impact resistance 
    Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc 
    Application: Suitable for confidential sealing of electronic components and electronic circuits


    Usage 
    Mix the adhesive according to the mass ratio and stir evenly. Apply it to the area to be bonded (sealed) and heat it to 80 ℃ to cure 

     

    Product packaging 
    A:12.5kg/barrel 
    B:5kg/barrel


    Storage and transportation 
    A:Store in a cool, dry and sealed manner, with a shelf life of 1 year 
    B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year 
    This product is not a hazardous material and can be used for general chemical transportation

     

    Two-component epoxy resin special adhesive

    ProductE4110
    Viscosity, mPa.S50000
    Component ABlack 
    Component BYellow
    A:B (Weight Ratio)100:40
    Operational Time4H(25℃,100g)
    Curing Conditions25℃,24H or 80℃,2H
    Cured Product Hardness, SHORED95
    Compression strength, MPa90
    Thermal deformation temperature,℃180
    Volume resistivity, Ω ·cm3.2×1016
    Surface resistivity, Ω2.5×1016
    Breakdown voltage, KV/nm20
    Dielectric constant4.5
    Dielectric loss50Hz,0.032 or 1MHz0.023

     

Two-component epoxy resin special adhesive

Application

· Confidential potting of electronic components · Confidential potting of electronic circuits

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