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- Details
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Product Introduction
This product is a two-component epoxy resin special adhesive
Product features: easy to use, easy to operate, strong adhesion, corrosion resistance, low shrinkage force
Characteristics of cured material: strong sealing and impact resistance
Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc
Application: Suitable for confidential sealing of electronic components and electronic circuits
Usage
Mix the adhesive according to the mass ratio and stir evenly. Apply it to the area to be bonded (sealed) and heat it to 80 ℃ to cureProduct packaging
A:12.5kg/barrel
B:5kg/barrel
Storage and transportation
A:Store in a cool, dry and sealed manner, with a shelf life of 1 year
B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year
This product is not a hazardous material and can be used for general chemical transportationTwo-component epoxy resin special adhesive
Product E4110 Viscosity, mPa.S 50000 Component A Black Component B Yellow A:B (Weight Ratio) 100:40 Operational Time 4H(25℃,100g) Curing Conditions 25℃,24H or 80℃,2H Cured Product Hardness, SHORE D95 Compression strength, MPa 90 Thermal deformation temperature,℃ 180 Volume resistivity, Ω ·cm 3.2×1016 Surface resistivity, Ω 2.5×1016 Breakdown voltage, KV/nm 20 Dielectric constant 4.5 Dielectric loss 50Hz,0.032 or 1MHz0.023
Two-component epoxy resin special adhesive
Application
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