





Two-component epoxy resin electronic adhesive
- Details
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Product Introduction
This product is a two-component epoxy resin electronic adhesive
Product features: easy to use, good fluidity, strong adhesion, corrosion resistance, low shrinkage force
Characteristics of cured material: good sealing and strong impact resistance
Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc
Application: Suitable for electronic component encapsulation, bonding, assembly, composite material molding, and other applications
Usage
Mix and stir the adhesive evenly according to the mass ratio, and apply it to the bonding area to achieve curing conditions (80 ℃/1hor 25 ℃/24h)
Product packaging
A:12kg/barrel
B:3kg/barrel
Storage and transportation
A:Store in a cool, dry and sealed manner, with a shelf life of 1 year
B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year
This product is not a hazardous material and can be used for general chemical transportationTwo-component epoxy resin electronic adhesive
Product
GF-3
GF-5
GF-6
GF-3R
Viscosity, mPa.S
100000
30000
10000
80000
Component A
Black or White
Black or White
Black
Black or White
Component B
Light yellow
Light yellow
Brownish yellow
Light yellow
A:B (Weight Ratio)
100:12
100:20
100:25
100:12
Operational Time
1H(25℃,100g)
6H(25℃,200g)
30min(25℃,100g)
1H(25℃,100g)
Curing Conditions
25℃,24H or 60℃,2H
120℃,2H
25℃,12H or 80℃,2H
25℃,24H or 60℃,2H
Advantages
Thermal Conductivity
Flame
RetardancyHardness, SHORE
D90
D85
D84
D90
Compression strength,MPa
75
95
75
80
AL-AL Floating RollerPeel Strength
12KN/m
12KN/m
12KN/m
12KN/m
Volume Resistivity, Ω·cm
6.2×1015
2.3×1016
2.2×1014
6.2×1015
Surface resistivity,Ω
2.2×1015
1.2×1016
2.2×1015
Breakdown Voltage, KV/nm
20
20
20
20
Dielectric constant
4.5
4.5
4.5
4.5
Dielectric Loss
50Hz,0.029 or 1MHz,0.06
50Hz,0.029 or 1MHz,0.06
50Hz,0.029 or 1MHz,0.06
50Hz,0.029 or 1MHz,0.06
Two-component epoxy resin electronic adhesive
Application
Consult
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