• Two-component epoxy resin electronic adhesive
  • Two-component epoxy resin electronic adhesive
  • Two-component epoxy resin electronic adhesive
  • Two-component epoxy resin electronic adhesive
  • Two-component epoxy resin electronic adhesive
  • Two-component epoxy resin electronic adhesive
Two-component epoxy resin electronic adhesive
Two-component epoxy resin electronic adhesive
Two-component epoxy resin electronic adhesive
Two-component epoxy resin electronic adhesive
Two-component epoxy resin electronic adhesive
Two-component epoxy resin electronic adhesive
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Two-component epoxy resin electronic adhesive

· Potting of electronic components · Bonding of electronic components · Bonding of metal materials · Bonding of composite materials ·Composite material molding

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  • Details
  • Product Introduction 
    This product is a two-component epoxy resin electronic adhesive 
    Product features: easy to use, good fluidity, strong adhesion, corrosion resistance, low shrinkage force 
    Characteristics of cured material: good sealing and strong impact resistance 
    Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc 
    Application: Suitable for electronic component encapsulation, bonding, assembly, composite material molding, and other applications


    Usage 
    Mix and stir the adhesive evenly according to the mass ratio, and apply it to the bonding area to achieve curing conditions (80 ℃/1hor 25 ℃/24h)


    Product packaging 
    A:12kg/barrel 
    B:3kg/barrel


    Storage and transportation 
    A:Store in a cool, dry and sealed manner, with a shelf life of 1 year 
    B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year 
    This product is not a hazardous material and can be used for general chemical transportation

     

    Two-component epoxy resin electronic adhesive

    Product

    GF-3

    GF-5

    GF-6

    GF-3R

    Viscosity, mPa.S

    100000

    30000

    10000

    80000

    Component A

    Black or White

    Black or White

    Black

    Black or White

    Component B

    Light yellow

    Light yellow

    Brownish yellow

    Light yellow

    A:B (Weight Ratio)

    100:12

    100:20

    100:25

    100:12

    Operational Time

    1H(25℃,100g)

    6H(25℃,200g)

    30min(25℃,100g)

    1H(25℃,100g)

    Curing Conditions

    25℃,24H or 60℃,2H

    120℃,2H

    25℃,12H or 80℃,2H

    25℃,24H or 60℃,2H

    Advantages

    Thermal Conductivity

    Flame 
    Retardancy

     

     

    Hardness, SHORE

    D90

    D85

    D84

    D90

    Compression strength,MPa

    75

    95

    75

    80

    AL-AL Floating RollerPeel Strength 

    12KN/m

    12KN/m

    12KN/m

    12KN/m

    Volume Resistivity,     Ω·cm

    6.2×1015

    2.3×1016

    2.2×1014

    6.2×1015

    Surface resistivity,Ω

    2.2×1015

    1.2×1016

     

    2.2×1015

    Breakdown Voltage, KV/nm

    20

    20

    20

    20

    Dielectric constant

    4.5

    4.5

    4.5

    4.5

    Dielectric Loss

    50Hz,0.029 or   1MHz,0.06

    50Hz,0.029 or   1MHz,0.06

    50Hz,0.029 or  1MHz,0.06

    50Hz,0.029  or  1MHz,0.06

     

Two-component epoxy resin electronic adhesive

Application

· Potting of electronic components · Bonding of electronic components · Bonding of metal materials · Bonding of composite materials ·Composite material molding

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