• One-component epoxy resin special adhesive
  • One-component epoxy resin special adhesive
  • One-component epoxy resin special adhesive
  • One-component epoxy resin special adhesive
  • One-component epoxy resin special adhesive
One-component epoxy resin special adhesive
One-component epoxy resin special adhesive
One-component epoxy resin special adhesive
One-component epoxy resin special adhesive
One-component epoxy resin special adhesive
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One-component epoxy resin special adhesive

· Confidential potting of electronic components · Confidential potting of electronic circuits

Email:

adayang@resinsealant.com

WhatsApp：

+86-15910569196

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  • Details

  • Product Introduction  
    This product is a single component epoxy resin special adhesive  
    Product features: easy to use, easy to operate, strong adhesion, corrosion resistance, low shrinkage force  
    Characteristics of cured material: thermal conductivity, high temperature resistance, high transparency, strong sealing, strong impact resistance  
    Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc  
    Application: Suitable for confidential sealing of heat generating electronic components and electronic circuits  
     

    Usage  
    Pour this adhesive directly into the glue slot, and after dispensing, wait for it to level and fill the gaps. Heat it to 100 ℃ to cure  
     

    Product packaging  
    A：10kg/barrel  
    B：1kg/barrel  
     

    Storage and transportation  
    A:Store in a cool, dry and sealed manner, with a shelf life of 1 year  
    B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year  
    This product is not a hazardous material and can be used for general chemical transportation

     

    One-component epoxy resin special adhesive

    ProductHS-2HHS-2H10
    Viscosity, mPa.S60000Paste does not flow
    colorBlack Grey
    Curing Conditions110℃,1.5H or 120℃,30min110℃,1.5H or 130℃,30min
    Cured Product Hardness, SHORED97D95
    Elongation at break9295
    Thermal deformation temperature,℃175205
    Thermal conductivity, W/m.k0.62
    Volume resistivity, Ω ·cm2.8×10152.8×1015
    Surface resistivity, Ω1.4×10151.4×1015
    Breakdown voltage, KV/nm2020
    Dielectric constant4.54.5
    Dielectric loss50Hz,0.051 or 1MHz0.02650Hz,0.051 or 1MHz0.026

     

One-component epoxy resin special adhesive

Application

· Confidential potting of electronic components · Confidential potting of electronic circuits

Email:

adayang@resinsealant.com

WhatsApp:

+86-15910569196

Consult
Related products

Consult

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Contact

EMAIL : adayang@resinsealant.com


WhatsApp：+86-15910569196

 

Address :No. 5A, Zhongnan Hi-Tech, No. 588, Deng Yun Street, Tangxi Town, Jinhua City, Zhejiang Province, China

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These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

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