







Two-component organic silicone electronic adhesive
- Details
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Product Introduction
This product is a two-component organic silicone electronic adhesive
Product features: easy to use, easy to operate, strong adhesion, corrosion resistance, low shrinkage,deep curing capability
Characteristics of cured materials: flame retardancy, good elasticity, high and low temperature resistance, conductivity, and disassembly capability
Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc
Application: Suitable for sealing and waterproof sealing of electronic components and circuits
Usage
Mix the adhesive according to the mass ratio and stir evenly. Pour it evenly into the device until it reaches the curing condition(25 ℃/1-4 hours), and it can be cured
Product packaging
A:25kg/barrel
B:5kg/barrel
Storage and transportation
A:Store in a cool, dry, and sealed container for 6 months
B:Sealed storage in a dark and moisture-proof environment, with a storage period of 6 months
This product is not a hazardous material and can be used for general chemical transportationTwo-component organic silicone electronic adhesive
Product
GF-T10D
GF-T3
GF-T17
GF-T18
Type
Additive type
Condensation type
Condensation type
Condensation type
Viscosity, mPa.S
5000
3000
5000
3000
Component A
White
Black
Black or White
Black or White
Component B
Black or White
Transparent
Transparent
Transparent
A:B (Weight Ratio)
100:100
100:3
100:10
100:10
Operational Time
1H(25℃,100g)
1H(25℃,200g)
1H(25℃,100g)
30min(25℃,100g)
Curing Conditions
25℃,24H or 60℃,2H
25℃,1-4H
25℃,1-4H
25℃,1-4H
Hardness, SHORE
A55
A40
A45
A45
Tensile strength, MPa
1.0
1.5
0.8
0.5
Elongation at break
100%
100%
100%
100%
Adhesion
Cohesive
destructionCohesive
destructionCohesive
destructionCohesive
destructionVolume resistivity, Ω ·cm
1 ×1014
1 ×1014
1 ×1014
1 ×1014
Breakdown voltage, KV/nm
18
18
18
18
Dielectric constant
2.9
2.7-3.3
2.7-3.3
2.7-3.3
Two-component organic silicone electronic adhesive
Application
Consult
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