• Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
  • Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
Two-component organic silicone electronic adhesive
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Two-component organic silicone electronic adhesive

· Potting of electronic components · Sealing and waterproofing of electronic components

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  • Details
  • Product Introduction 
    This product is a two-component organic silicone electronic adhesive 
    Product features: easy to use, easy to operate, strong adhesion, corrosion resistance, low shrinkage,deep curing capability 
    Characteristics of cured materials: flame retardancy, good elasticity, high and low temperature resistance, conductivity, and disassembly capability 
    Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc 
    Application: Suitable for sealing and waterproof sealing of electronic components and circuits


    Usage 
    Mix the adhesive according to the mass ratio and stir evenly. Pour it evenly into the device until it reaches the curing condition(25 ℃/1-4 hours), and it can be cured


    Product packaging 
    A:25kg/barrel 
    B:5kg/barrel


    Storage and transportation 
    A:Store in a cool, dry, and sealed container for 6 months 
    B:Sealed storage in a dark and moisture-proof environment, with a storage period of 6 months 
    This product is not a hazardous material and can be used for general chemical transportation

     

    Two-component organic silicone electronic adhesive

    Product

    GF-T10D

    GF-T3

    GF-T17

    GF-T18

    Type

    Additive type

    Condensation type

    Condensation type

    Condensation type

    Viscosity, mPa.S

    5000

    3000

    5000

    3000

    Component A

    White

    Black

    Black or White

    Black or White

    Component B

    Black or White

    Transparent

    Transparent

    Transparent

    A:B (Weight Ratio)

    100:100

    100:3

    100:10

    100:10

    Operational Time

    1H(25℃,100g)

    1H(25℃,200g)

    1H(25℃,100g)

    30min(25℃,100g)

    Curing Conditions

    25℃,24H or 60℃,2H

    25℃,1-4H

    25℃,1-4H

    25℃,1-4H

    Hardness, SHORE

    A55

    A40

    A45

    A45

    Tensile strength, MPa

    1.0

    1.5

    0.8

    0.5

    Elongation at break

    100%

    100%

    100%

    100%

    Adhesion

    Cohesive 
    destruction

    Cohesive 
    destruction

    Cohesive 
    destruction

    Cohesive 
    destruction

    Volume resistivity, Ω ·cm

    1 ×1014

    1 ×1014

    1 ×1014

    1 ×1014

    Breakdown voltage, KV/nm

    18

    18

    18

    18

    Dielectric constant

    2.9

    2.7-3.3

    2.7-3.3

    2.7-3.3

     

Two-component organic silicone electronic adhesive

Application

· Potting of electronic components · Sealing and waterproofing of electronic components

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