





One-component epoxy resin electronic adhesive
- Details
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Product Introduction
This product is a one-component epoxy resin electronic adhesive (relay sealing)
Product features: easy to use, good fluidity, strong adhesion, low curing temperature, corrosion resistance, low shrinkage force
Characteristics of cured material: Matte finish, good sealing performance
Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc
Application: Suitable for sealing, bonding, and assembly of relay products
Usage
Pour this adhesive directly into the glue slot, and after dispensing, wait for it to level and fill the gaps. Heat it to 90-110 ℃ to cure
Product packaging
·5kg/barrel
Storage and transportation
·Low temperature sealed storage, storage period of 25 ℃/2 months (or -15 ℃/6 months)
·Our company conducts freezing treatment before shipment, and during transportation, it is packed in insulated foam boxes with ice bags inside
·This product is not a hazardous material and can be used for general chemical transportationOne-component epoxy resin electronic adhesive
Product
HS-3
Viscosity, mPa.S
25000-40000
Color
Black or White
Curing Conditions
110℃,30min
Cured Product Hardness, SHORE
D90
Tracking Index
CTI400
Breakdown Voltage, KV/nm
20
Surface effect
Matte
One-component epoxy resin electronic adhesive
Application
Consult
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