• One-component epoxy resin electronic adhesive
  • One-component epoxy resin electronic adhesive
  • One-component epoxy resin electronic adhesive
  • One-component epoxy resin electronic adhesive
  • One-component epoxy resin electronic adhesive
  • One-component epoxy resin electronic adhesive
One-component epoxy resin electronic adhesive
One-component epoxy resin electronic adhesive
One-component epoxy resin electronic adhesive
One-component epoxy resin electronic adhesive
One-component epoxy resin electronic adhesive
One-component epoxy resin electronic adhesive
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One-component epoxy resin electronic adhesive

· Potting of electronic components · Bonding of electronic components · Bonding of metal materials · Bonding of composite materials · Composite material molding

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  • Details
  • Product Introduction 
    This product is a one-component epoxy resin electronic adhesive (relay sealing) 
    Product features: easy to use, good fluidity, strong adhesion, low curing temperature, corrosion resistance, low shrinkage force 
    Characteristics of cured material: Matte finish, good sealing performance 
    Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc 
    Application: Suitable for sealing, bonding, and assembly of relay products 
     

    Usage 
    Pour this adhesive directly into the glue slot, and after dispensing, wait for it to level and fill the gaps. Heat it to 90-110 ℃ to cure 
     

    Product packaging 
    ·5kg/barrel 
     

    Storage and transportation 
    ·Low temperature sealed storage, storage period of 25 ℃/2 months (or -15 ℃/6 months) 
    ·Our company conducts freezing treatment before shipment, and during transportation, it is packed in insulated foam boxes with ice bags inside 
    ·This product is not a hazardous material and can be used for general chemical transportation

     

    One-component epoxy resin electronic adhesive

    Product

    HS-3

    Viscosity, mPa.S

    25000-40000

    Color

    Black or White

    Curing Conditions

    110℃,30min

    Cured Product Hardness, SHORE

    D90

    Tracking Index

    CTI400

    Breakdown Voltage, KV/nm

    20

    Surface effect

    Matte

     

One-component epoxy resin electronic adhesive

Application

· Potting of electronic components · Bonding of electronic components · Bonding of metal materials · Bonding of composite materials · Composite material molding

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