








Two-component epoxy resin film module adhesive
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Product Introduction
This product is a two-component epoxy resin film component adhesive
Product features: easy to use, good fluidity, strong adhesion, corrosion resistance, low shrinkage force
Characteristics of cured material: bright surface, good flexibility, good flame retardancy, good sealing, strong impact resistance
Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc
Application: Suitable for PVDF membrane components, water treatment membrane components,electronic circuit encapsulation, bonding, assembly, etc
Usage
Mix the adhesive according to the mass ratio and stir evenly. Pour it evenly into the device until it reaches the curing conditions(60 ℃/4h or 25 ℃/48h), and it can be cured
Product packaging
A:10kg/barrel
B:5kg/barrel
Storage and transportation
A:Store in a cool, dry and sealed manner, with a shelf life of 1 year
B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year
This product is not a hazardous material and can be used for general chemical transportationTwo-component epoxy resin film module adhesive
Product H2020 H2037 H2039 Viscosity, mPa.S 500 1200 1500 Component A Light yellow Light yellow Light yellow Component B Light yellow Light yellow Light yellow A:B (Weight Ratio) 100:40 100:50 100:40 Operational Time 4H(25℃,100g) 4H(25℃,100g) 1.5H(25℃,100g) Surface drying time 6-8H(25℃,100g) 6-8H(25℃,100g) 4-6H(25℃,100g) Curing Conditions 25℃,24H 25℃,24H 25℃,24H AL-ALFloating RollerPeel Strength 25 20 Glass transition temperature, °C -5 65 105 tensile strength 40 60 Elongation at break 6% 4% Hardness, SHORE A30-60 25℃,D84 or 45℃,D60 25℃,D84 or 80℃,D73 PH=1 hydrochloric acid (28 days) D82 D83 4% sodium hydroxide (28 days) D82 D83 1% sodium hypochlorite (28 days) D82 D83
Two-component epoxy resin film module adhesive
Application
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