• Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
  • Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
Two-component epoxy resin film module adhesive
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Two-component epoxy resin film module adhesive

· Potting of membrane modules · Potting of water treatment membrane components · Potting of electronic components · Potting of electronic circuits ·Composite material molding

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  • Details
  • Product Introduction 
    This product is a two-component epoxy resin film component adhesive 
    Product features: easy to use, good fluidity, strong adhesion, corrosion resistance, low shrinkage force 
    Characteristics of cured material: bright surface, good flexibility, good flame retardancy, good sealing, strong impact resistance 
    Applicable materials: Suitable for bonding metals, stones, ceramics, composite materials, etc 
    Application: Suitable for PVDF membrane components, water treatment membrane components,electronic circuit encapsulation, bonding, assembly, etc 
     

    Usage 
    Mix the adhesive according to the mass ratio and stir evenly. Pour it evenly into the device until it reaches the curing conditions(60 ℃/4h or 25 ℃/48h), and it can be cured 
     

    Product packaging 
    A:10kg/barrel 
    B:5kg/barrel 
     

    Storage and transportation 
    A:Store in a cool, dry and sealed manner, with a shelf life of 1 year 
    B:Sealed storage in a dark and moisture-proof environment, with a storage period of 1 year 
    This product is not a hazardous material and can be used for general chemical transportation

     

    Two-component epoxy resin film module adhesive

    ProductH2020H2037H2039
    Viscosity, mPa.S50012001500
    Component ALight yellowLight yellowLight yellow
    Component BLight yellowLight yellowLight yellow
    A:B (Weight Ratio)100:40100:50100:40
    Operational Time4H(25℃,100g)4H(25℃,100g)1.5H(25℃,100g)
    Surface drying time6-8H(25℃,100g)6-8H(25℃,100g)4-6H(25℃,100g)
    Curing Conditions25℃,24H25℃,24H25℃,24H
    AL-ALFloating RollerPeel Strength 2520
    Glass transition temperature, °C-565105
    tensile strength 4060
    Elongation at break 6%4%
    Hardness, SHOREA30-6025℃,D84 or 45℃,D6025℃,D84 or 80℃,D73
    PH=1 hydrochloric acid (28 days) D82D83
    4% sodium hydroxide (28 days) D82D83
    1% sodium hypochlorite (28 days) D82D83

     

Two-component epoxy resin film module adhesive

Application

· Potting of membrane modules · Potting of water treatment membrane components · Potting of electronic components · Potting of electronic circuits ·Composite material molding

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